ullc0402fc05c* unbumped low capacitance flip chip array 1 05192.r3 8/06 *u.s. patent no. 6,867,436 www.protekdevices.com applications ? cellular phones ? personal digital assistant (pda) ? notebook computers ? smart cards iec compatibility (en61000-4) ? 61000-4-2 (esd): air - 15kv, contact - 8kv ? 61000-4-4 (eft): 40a - 5/50ns features ? esd protection > 25 kilovolts ? low esd overshoot voltage ? bidirectional configuration & monolithic structure ? protects 1 line ? low capacitance: 6pf ? low leakage current ? rohs compliant mechanical characteristics ? standard eia chip size: 0402 ? weight 0.73 milligrams (approximate) ? solder reflow temperature: lead-free: 260-270c ? flammability rating ul 94v-0 ? 8mm plastic & paper tape and reel per eia standard 481 ? device marking on reel 05192 pin configuration u0402
2 05192.r3 8/06 www.protekdevices.com ullc0402fc05c device characteristics storage temperature symbol v alue c -55c to 150c units t stg parameter operating temperature t j -55c to 150c c maximum ratings @ 25c unless otherwise specified note 1: device is bidirectional. part number (see notes 1) minimum breakdown voltage @ 1ma v (br) volts typical capacitance 0v @ 1 mhz c pf ullc0402fc05c 6.0 6 maximum leakage current @v wm i d a 1.0 rated stand-off voltage v wm volts 5.0 electrical characteristics per line @ 25c unless otherwise specified
3 05192.r3 8/06 www.protekdevices.com ullc0402fc05c esd test pulse - 25 kilovolt, 1/30ns (waveshape) figure 1 overshoot & clamping voltage 5 volts per division -5 5 15 25 35 v r - reverse voltage - volts c j - capacitance - pf figure 2 capacitance vs reverse voltage graphs
4 05192.r3 8/06 www.protekdevices.com ullc0402fc05c ramp-up ramp-down ramp-up 15 seconds solder time 15-20 seconds ramp-down t s - preheat t smax t smin t l t 25c to peak 30-60 seconds temperature - c t p 155 140 0.275mm round non-solder mask defined pads 0.325mm round 0.150mm 0.330mm round no clean osp(entek cu plus 106a) 50m 20m 60 seconds 270c pad size on pcb pad shape pad definition solder mask opening solder stencil thickness solder stencil aperture opening (laser cut, 5% tapered walls) solder paste type pad protective finish tolerance - edge to corner ball solder ball side coplanarity maximum dwell time above liquidous (183c) soldering maximum temperature printed circuit board recommendations parameter value requirements temperature: t p for lead-free (snagcu): 260-270c t p for tin-lead: 240-245c preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. recommended non-solder mask defined pad illustration non-solder mask defined pad 0.275mm dia. solder mask opening 0.325mm dia. solder stencil opening 0.330mm dia. application information
5 05192.r3 8/06 www.protekdevices.com ullc0402fc05c u0402 package outline & dimensions copyright ? prot ek devices 2006 specifications: protek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except jedec). design changes: protek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer?s and that in furnishing engineering and technical assistance, protek assumes no responsibility with respect to the selec tion or specifications of such products. protek devices 2929 south fair lane, tempe, az 85282 tel: 602-431-8101 fax: 602-431-2288 e-mail: sales@protekdevices.com web site: www.protekdevices.com tape & reel ordering nomenclature 1. surface mount product is taped and reeled in accordance with eia 481. 2. 8mm plastic tape: 7 inch reels - 5,000 pieces per reel. ordering suffix:: -t75-1, i.e., ULLC0402FC05C-T75-1 . 3. 8mm paper tape: 7 inch reels -10,000 pieces per reel. ordering suffix : -t710-2, i.e., ullc0402fc05c-t710-2. a b c d e f i 0.61 nom 0.86 nom 0.99 0.0254 0.10 nom 0.35 nom 0.483 0.0254 0.406 nom 0.024 nom 0.034 nom 0.039 0.001 0.004 nom 0.014 nom 0.019 0.001 0.016 nom dim millimeters inches package dimensions notes: 1. controlling dimensions in inches. 2. decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002?). 3. maximum chip size: 1.02 (0.040?) by 0.51(0.020?). package outline mounting pad a b c d e f g h i 0.23 0.48 0.69 0.46 0.99 0.20 0.20 0.66 0.13 0.009 0.019 0.027 0.018 0.039 0.008 0.008 0.026 0.005 dim millimeters inches pad dimensions note: 1. top view of tape. metal contacts are face down in tape package. tape & reel orientation outline & dimensions: rev 4 - 10/05, 6020 single die - 0402
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$( tape & reel specifications (dimensions in millimeters) de p0 tmax fp2 w 1.50 0.10 1.75 0.10 3.50 0.05 8.00 0.30 4.00 0.10 2.00 0.05 p 2.00 0.10 0.25 a0 b0 k0 reel dia. tape width 178mm (7?)/330mm(13?) 8mm 0.80 0.10 1.20 0.10 0.70 0.10
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note: 1. preferred: using 0.1mm (0.004?) stencil.
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